Endura Technologies, a global leader in high-performance power management solutions, today announced the appointment of Biren Minhas as Senior Vice President of Engineering. Minhas brings more than 25 years of experience delivering high-volume power-management and mixed-signal ICs. He will lead Endura’s engineering organization.
“As we advance our power delivery solutions for next-generation AI and high-performance computing, strengthening our engineering leadership is a key step in scaling the company,” said Dr. Davood Yazdani, Executive Vice President / Chief Product Officer of Endura Technologies. “Biren combines deep technical expertise with a clear understanding of what Tier 1 customers require. He will play a critical role in driving engineering execution and ensuring our development efforts deliver the performance, efficiency, and time to market our customers expect.”
Most recently, Minhas served as Vice President of Design Engineering at Cirrus Logic, following his tenure as Director of Engineering at Dialog Semiconductor. He has led cross-functional teams spanning systems engineering, design, verification, layout and project management, and has worked closely with Tier 1 customers and leading foundries to bring complex ICs into high-volume production.
At Endura, Minhas will focus on scaling engineering capabilities, strengthening development processes and introducing proven methodologies to support the company’s growing product roadmap.
“I’m excited to join Endura Technologies and be part of the team driving its next chapter of innovation,” said Minhas. “I look forward to tackling complex engineering challenges and bringing new solutions to market that deliver meaningful value for our customers.”
For more information, please visit www.enduratechnologies.com.
About Endura Technologies
Endura Technologies develops ultra-high-density power management solutions to efficiently power advanced SoCs, GPUs and chiplets. Its patented, agnostic digital architecture is engineered to scale with advanced process nodes to meet the growing demands of tomorrow’s AI factories. By offering industry-leading current density, ultra-high switching frequency, ultra-fast transient response and ultra-low ripple, Endura Technologies’ solutions effectively overcome the physical limitations of traditional power delivery solutions, enabling seamless integration into next-generation 2.5D and 3D AI system architectures. For more information, please visit Endura Technologies.
View source version on businesswire.com: https://www.businesswire.com/news/home/20261110066855/en/
Media gallery
